PART |
Description |
Maker |
BC10-12 |
Absorbent Glass mat technology for efficient gas recombinatino
|
B. B. Battery Co., Ltd.
|
71607-302ALF 71607-402ALF 71607-340ALF 71607-440AL |
2 CONTACT(S), FEMALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SURFACE MOUNT, RECEPTACLE HOUSIN MAT: THERMOPLASTIC GLASS FILLED
|
http:// FCI connector
|
PR010002 PR010003 PP040001 PP050002 PP040002 PRO50 |
MAT PRFRNCE 1.5X0.9 CHA/GRY MAT PRFRNCE 1.8X1.2 CHR/GRY MAT POLYPLUSH 0.9X0.6 GRN 垫POLYPLUSH 0.9X0.6 GRN MAT POLYPLUSH 1.5X0.9 BRWN 垫POLYPLUSH 1.5X0.9 BRWN MAT POLYPLUSH 1.5X0.9 GRN 垫POLYPLUSH 1.5X0.9 GRN MAT PRFRNCE 1.5X0.9 BRWN 垫PRFRNCE 1.5X0.9 BRWN MAT PRFRNCE 1.5X0.9 BLUE 垫PRFRNCE 1.5X0.9
|
YEONHO Electronics Co., Ltd. Central Semiconductor, Corp. Vishay Intertechnology, Inc.
|
CF50 CF3050 CF1050 CF4050 CFP50 |
The highly absorbent precision cleaning swab with a wide variety of head sizes and shapes
|
List of Unclassifed Manufacturers
|
SED1278DOH SED1278FOH SED1278DOA |
16 X 40 DOTS DOT MAT LCD DRVR AND DSPL CTLR, UUC80 ALUMINUM PAD, DIE-80 16 X 40 DOTS DOT MAT LCD DRVR AND DSPL CTLR, PQFP80 PLASTIC, QFP5-80
|
IRC Advanced Film
|
DSF20060SF60 DSF20060SF DSF20060SF55 DSF20060SF56 |
Fast Recovery Diode Chip-on-Glass (COG) Technology, 16 Characters x 2 Lines 620 A, 5500 V, SILICON, RECTIFIER DIODE
|
DYNEX SEMICONDUCTOR LTD DYNEX[Dynex Semiconductor] Dynex Semiconductor, Ltd.
|
0334720806 |
MX150 2X4 RECEPTACLE SEALED ASSEMBLY MAT SEAL
|
Molex Electronics Ltd.
|
PIC18F4580 PIC18F2480 PIC18F2480_07 PIC18F2580 PIC |
28/40/44-Pin Enhanced Flash Microcontrollers with ECAN Technology, 10-Bit A/D and nanoWatt Technology
|
MICROCHIP[Microchip Technology]
|
PIC18F2685-I/ML PIC18LF2685-I/SO PIC18F2685-I/P PI |
28/40/44-Pin Enhanced Flash Microcontrollers with ECAN Technology, 10-Bit A/D and nanoWatt Technology
|
Microchip Technology
|
PIC18F248009 PIC18F4480-E_ML PIC18LF4480-E_ML PIC1 |
28/40/44-Pin Enhanced Flash Microcontrollers with ECAN Technology, 10-Bit A/D and nanoWatt Technology
|
Microchip Technology
|